Handbook Of VLSI Microlithography: Principles, Technology And Applications

This handbook provides an in-depth overview of the entire technology involved in printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings, including optical lithography, electron beam, ion beam, and x-ray lithography. It focuses on the special printing processes required for high-volume, high-density IC chip production, especially in the DRAM industry.

The book begins with a comparison of various lithography methods, discussing key patterning parameters such as line/space resolution, edge control, and feature dimensions. It explains resist technology and process equipment, including relationships between resist processes and equipment parameters. The fundamentals of resist technology are thoroughly covered, including chapters on defectivity and yield considerations.

The book reviews different lithographic techniques, testing methods, and metrology, such as optical and SEM techniques, alongside explanations of printing tools, their design, construction, and performance. It includes dedicated chapters on electron-beam printers and emerging x-ray printing technologies used in high-density CMOS devices. An additional section discusses ion particle printing, a controllable technology that does not rely on resist.